C4730 教學大綱表

教學大綱表 Syllabus

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課程名稱 Course Title	(中文) 半導體元件製造程序 (英文) Fabricating Pprocess Of Semiconductor Devices			開課單位 Departments	化學工程與生物科技學系
				課程代碼 Course No.	C4730
授課教師 Instructor	郭欽湊
學分數 Credit	3.0	必/選修 core required/optional	選修	開課年級 Level	大四
先修科目或先備能力Course Pre-requisites：化學與物理
課程概述與目標 Course Overview and Goals：介紹半導體材料與基礎理論，IC製程及檢測技術
教科書 Textbook	李克駿李克慧李名錄編著 "半導體製程概論" 第四版全華圖書公司 [黃文珍 0958008962 (02-22625666--- 160) 2020/11
參考教材 Reference

課程大綱 Syllabus			學生學習目標 Learning Objectives	單元學習活動 Learning Activities	學習成效評量 Evaluation	備註 Notes
週 Week	單元主題 Unit topic	內容綱要 Content summary	學生學習目標 Learning Objectives	單元學習活動 Learning Activities	學習成效評量 Evaluation	備註 Notes
1	前言半導體與積體電路發展史	History Transistor IC IC semiconductor processes	Overview of semiconductor history
2	第一章晶體結構與矽半導體物理特性	Atomic model and Periodic table Crystal structure Material conductivity (Dopant, n-type and p-type)	Review of General Chemistry
3	第二章半導體能帶與載子傳輸	Energy band Resistivity and stress resistance Carrier transport	Review of General Physics
4	第三章化合物半導體晶體結構與物理特性	Compound semiconductors Crystal structure and energy band of Gallium Arsenide Crystal structure and energy band of Gallium Nitride Crystal structure and energy band of Silicon Carbide	Review of General Materials
5	第四章半導體基礎元件	Diode Transistor Capacitor DRAM and SRAM	Overview of discrete devices
6	第五章接面能帶與費米能階	Density of states Fermi distribution function of Intrinsic semiconductor and Doped semiconductors Fermi level and junction band diagram	Understand of semiconductor physics
7	第六章積體電路製程與佈局	Circuit and Integrated Circuit(IC) Design rules Layout	Overview of semiconductor design
8	第七章半導體元件縮小化與先進奈米元件	Scaling of MOSFET Short-channel effects SOI-MOSFET FinFET 3 Dimensional IC	Understand of advanced IC devices
9	第十章矽晶棒之生長	Starting materials Silicon ingot growth (CZ and FZ) Dopants distribution in crystal growth Crystal defects	Understand of Silicon wafer fabrication
10	第十一章矽晶圓之製作	Crystal orientation Orientation Sawing and Polishing Benefit analysis of 12 inch wafer	Study of silicon wafer
11	第十三章矽磊晶生長	Epitaxial layer Silicon epitaxy Growth process of Si epitaxial layer	Studies of epitaxial layer
12	第十六章矽氧化膜生長	Thermal oxidation furnace Si oxidation process Dry and wet oxidation and thickness Redistribution of dopant during thermal oxidation	Studies of Si oxidation
13	第十八章擴散與離子佈植	Diffusion process The predeposition and drive in Distribution of diffusion Ion implantation	Studies of diffusion and ion implantation
14	第二十章微影技術	Lithography Fabrication of mask Photolithography Resolution enhancement techniques	Studies of photolithography
15	第二十一章蝕刻技術	Wet etching of Si and compound semiconductors Dry etching	Studiesof wet and dry etchings
16	第二十二章化學與物理氣相沉積	CVD procedures Plasma CVD Photo-CVD Atomic layer deposition PVD	Studies of CVD and PVD	講授	作業 Assignment
17	第二十四章積體電路封裝	IC package packaging flow chart 3 Dimensional package	Studies of IC package
18	第二十五章積體電路故障與檢測	Basic idea of reliability Failure models EMI and ESD Surface morphology, crystal structure, and composition analysis instruments	Studies of IC testing and relative instruments

教學要點概述 Overview of Teaching Points：
教材編選 Teaching Materials： □ 自編教材 Handout by Instructor ■ 教科書作者提供 Textbook
評量方法 Evaluation：期末考 Final Exam：30% 期中考 Midterm：30% 報告 Presentation：10% 平時考 Test：10% 作業 Assignment：20%
教學資源 Teaching Resources： ■ 教材電子檔 Soft Copy of the Handout or the Textbook □ 課程網站 Website
扣考規定 The rule of being able to take the final exam of the course：http://eboard.ttu.edu.tw/ttuwebpost/showcontent-news.php?id=504