教學大綱表 (111學年度 第2學期)
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課程名稱
Course Title
(中文) 半導體先進封裝
(英文) Semiconductor Advanced Packaging
開課單位
Departments
電機工程研究所
課程代碼
Course No.
E5100
授課教師
Instructor
黃順斌
學分數
Credit
3.0 必/選修
core required/optional
選修 開課年級
Level
研究所
先修科目或先備能力(Course Pre-requisites):
課程概述與目標(Course Overview and Goals):[課程概述] 半導體先進封裝簡介 == 架構/材料/工法 (晶圓級封裝/異質整合/小晶粒) 並舉例說明先進封裝相關專利的撰寫及申請
[目標] 以產業的實例來深入淺出地引導學生瞭解“半導體先進封裝”
教科書(Textbook) * Fan-out WLP 2018 by John H. Lau, ISBN 978-981-10-8884-1 (ebook)
*TSMC Packaging Technologies for Chiplets and 3D 2021 by Dr. Douglas Yu ,TSMC Property
*Advanced Packaging Materials Challenges & Opportunities
2017 by Dr. Ashay Dani, INTEL Property
參考教材(Reference) •網站:IEEE Electronics Packaging Society : Heterogeneous Integration Roadmap 2021 Edition. https://eps.ieee.org/technology/heterogeneous-integration-roadmap/2021-edition.html
•Youtube Channel : Semicon Talk https://www.youtube.com/channel/UCgusXMss_OEWmT4HVbesaNA
課程大綱 Syllabus 學生學習目標
Learning Objectives
單元學習活動
Learning Activities
學習成效評量
Evaluation
備註
Notes

No.
單元主題
Unit topic
內容綱要
Content summary
1 半導體製程簡介 (6h) What's FEOL/BEOL/MEOL
What's WLP/Heterogeneous Integration/Chiplets
Brief Introduction of Taiwan Semiconductor Industry
briefly realize and understand the Taiwan semiconductor Industry , and Advanced Semiconductor Packaging,
How to prepare for this class and reach the goal .
 
2 論文研習技巧 (3h) How to search and read Papers for your study and research? enhance student's searching capability to catch the keywords and also reading capability to understand the papers . Moreover, sketch the framework of your study and research.  
3 業界實例簡介 (12h) TSMC 3D Fabric
INTEL Advanced Packaging
help student to pick up the latest trend and technology of TSMC and INtel in advanced Packaging  
4 半導體先進封裝專利介紹 (9h) 以個人的兩項封裝技術專利為例,介紹專利寫作,申請,答辯相關過程 encourage student to catch innovation ideas and realize toward the patent based on my previous experiences in developing related patents in advanced packaging.  
5 交連技術深入 (3h) Deep into Interconnect : Cu bump, Cu pillar, Solder joint, and Cu-Cu direct Bonding(hybrid bonding) Goal to understand the basic of forming the interconnect bwtween chips. such as solder reflow bonding, Cu micro bumps, Cu pillars, and direct cu-cu bonding.  
6 交連材料 (6h) Alternative material for Solder : TLPS Cu-Sn Composite and Nano Porous Cu Goal to introduce the basic composition of interconnect material ,evolution of alternatives and also innovation of noval material/methods.  
7 先進封裝的散熱 (6h) Thermal Management for Advanced Packaging : Lidded, Lidless, and Others…. to realize the exact thermal management of CPU/GPU, and also High power devices  
8 分組報告 (9h) 各組發表心得報告
個人心得告告
cultivate the teamwork and also strengthen the individual presentation skill and check the understanding of this class.  


教學要點概述:
1.自編教材 Handout by Instructor:
□ 1-1.簡報 Slids
□ 1-2.影音教材 Videos
□ 1-3.教具 Teaching Aids
□ 1-4.教科書 Textbook
□ 1-5.其他 Other
□ 2.自編評量工具/量表 Educational Assessment
□ 3.教科書作者提供 Textbook

成績考核 Performance Evaluation: 專題:50%   報告:25%   作業:25%  

教學資源(Teaching Resources):
□ 教材電子檔(Soft Copy of the Handout or the Textbook)
□ 課程網站(Website)
扣考規定:https://curri.ttu.edu.tw/p/412-1033-1254.php