| 課程大綱 Syllabus |
學生學習目標
Learning Objectives |
單元學習活動
Learning Activities |
學習成效評量
Evaluation |
備註
Notes |
序
No. | 單元主題
Unit topic |
內容綱要
Content summary |
| 1 | 半導體製程簡介 (6h) |
What's FEOL/BEOL/MEOL
What's WLP/Heterogeneous Integration/Chiplets
Brief Introduction of Taiwan Semiconductor Industry |
briefly realize and understand the Taiwan semiconductor Industry , and Advanced Semiconductor Packaging,
How to prepare for this class and reach the goal . |
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| 2 | 論文研習技巧 (3h) |
How to search and read Papers for your study and research? |
enhance student's searching capability to catch the keywords and also reading capability to understand the papers . Moreover, sketch the framework of your study and research. |
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| 3 | 業界實例簡介 (12h) |
TSMC 3D Fabric
INTEL Advanced Packaging |
help student to pick up the latest trend and technology of TSMC and INtel in advanced Packaging |
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| 4 | 半導體先進封裝專利介紹 (9h) |
以個人的兩項封裝技術專利為例,介紹專利寫作,申請,答辯相關過程 |
encourage student to catch innovation ideas and realize toward the patent based on my previous experiences in developing related patents in advanced packaging. |
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| 5 | 交連技術深入 (3h) |
Deep into Interconnect : Cu bump, Cu pillar, Solder joint, and Cu-Cu direct Bonding(hybrid bonding) |
Goal to understand the basic of forming the interconnect bwtween chips. such as solder reflow bonding, Cu micro bumps, Cu pillars, and direct cu-cu bonding. |
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| 6 | 交連材料 (6h) |
Alternative material for Solder : TLPS Cu-Sn Composite and Nano Porous Cu |
Goal to introduce the basic composition of interconnect material ,evolution of alternatives and also innovation of noval material/methods. |
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| 7 | 先進封裝的散熱 (6h) |
Thermal Management for Advanced Packaging : Lidded, Lidless, and Others…. |
to realize the exact thermal management of CPU/GPU, and also High power devices |
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| 8 | 分組報告 (9h) |
各組發表心得報告
個人心得告告 |
cultivate the teamwork and also strengthen the individual presentation skill and check the understanding of this class. |
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