課程大綱 Syllabus |
學生學習目標 Learning Objectives |
單元學習活動 Learning Activities |
學習成效評量 Evaluation |
備註 Notes |
序 No. | 單元主題 Unit topic |
內容綱要 Content summary |
1 | Introduction of Semiconductor Technology |
1. Semiconductor Devices
2. Semiconductor Technology |
1. Semiconductor Devices
2. Semiconductor Technology |
|
|
|
2 | 期中考 |
期中學習評量 |
期中學習評量 |
|
|
|
3 | 半導體材料 |
1. 晶體結構
2. 能隙概念
3. 光子吸收
4. 載子傳輸 |
1. 晶體結構
2. 能隙概念
3. 光子吸收
4. 載子傳輸 |
|
|
|
4 | 半導體材料 |
1. 晶體結構
2. 能隙概念
3. 光子吸收
4. 載子傳輸 |
1. 晶體結構
2. 能隙概念
3. 光子吸收
4. 載子傳輸 |
|
|
|
5 | PN接面結構(LED、photodiode and solar cell...) |
1. PN接面的形成
2. 電流電壓解析
3. 應用 |
1. PN接面的形成
2. 電流電壓解析
3. 應用 |
|
|
|
6 | PN接面結構(LED、photodiode and solar cell...) |
1. PN接面的形成
2. 電流電壓解析
3. 應用 |
1. PN接面的形成
2. 電流電壓解析
3. 應用 |
|
|
|
7 | 金氧半結構 |
1. 金氧半電容形成
2. 金氧半場效電晶體(MOSFET)
3. 薄膜電晶體(TFT) |
1. 金氧半電容形成
2. 金氧半場效電晶體(MOSFET)
3. 薄膜電晶體(TFT) |
|
|
|
8 | 金氧半結構 |
1. 金氧半電容形成
2. 金氧半場效電晶體(MOSFET)
3. 薄膜電晶體(TFT) |
1. 金氧半電容形成
2. 金氧半場效電晶體(MOSFET)
3. 薄膜電晶體(TFT) |
|
|
|
9 | 金氧半結構 |
1. 金氧半電容形成
2. 金氧半場效電晶體(MOSFET)
3. 薄膜電晶體(TFT) |
1. 金氧半電容形成
2. 金氧半場效電晶體(MOSFET)
3. 薄膜電晶體(TFT) |
|
|
|
10 | Oxidation |
1. Growth Mechanism
2. Thin Oxides
3. Defects and Measurement |
1. Growth Mechanism
2. Thin Oxides
3. Defects and Measurement |
|
|
|
11 | Lithography |
1. Optical Ligthography
2. E-beam |
1. Optical Ligthography
2. E-beam |
|
|
|
12 | Plasma Etching |
1. Plasma properties
2. RIE facility |
1. Plasma properties
2. RIE facility |
|
|
|
13 | Thin film deposition I |
1. Thin film overview
2. Poly films
3. Nitride films
4. CVD and PVD |
1. Thin film overview
2. Poly films
3. Nitride films
4. CVD and PVD |
|
|
|
14 | Thin film deposition II |
1. TFT
2. Advance thin film process and measurement
3. Surface effect |
1. TFT
2. Advance thin film process and measurement
3. Surface effect |
|
|
homework for film depo and etch |
15 | Diffusion |
1. Impurity
2. Atomic diffusion model
3. RTP |
1. Impurity
2. Atomic diffusion model
3. RTP |
|
|
|
16 | Ion Implantation |
1. Implantation Equipment
2. Annealing
3. Shallow Junction |
1. Implantation Equipment
2. Annealing
3. Shallow Junction |
|
|
|
17 | Metallization |
1. Metal films
2. PVD in detail
3. Measurement and resistivity |
1. Metal films
2. PVD in detail
3. Measurement and resistivity |
|
|
|
18 | Term end Exam |
Final test for your knowledge in fabrication and process integration |
Final test for your knowledge in fabrication and process integration |
|
|
|