教學大綱表 (105學年度 第2學期)
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課程名稱
Course Title		 (中文) 半導體製程技術
(英文) Semiconductor Manufacturing Technology 		開課單位
Departments		 材料工程學系
課程代碼
Course No.		 T3600
授課教師
Instructor		 施文欽
學分數
Credit		 3.0 必/選修
core required/optional		 選修 開課年級
Level		 大三
先修科目或先備能力(Course Pre-requisites)：普通物理
課程概述與目標(Course Overview and Goals)： 使同學對半導體製程技術與現況有深入的瞭解
教科書(Textbook) Michael Quirk; Semiconductor Manufacturing Technology; Prentice Hall.
參考教材(Reference) Stanley Wolf; Silicon Processing for the VLSI Era Vol. 1; Lattice Press
課程大綱 Syllabus 學生學習目標
Learning Objectives		 單元學習活動
Learning Activities		 學習成效評量
Evaluation		 備註
Notes
序
No.		 單元主題
Unit topic		 內容綱要
Content summary
1 Introduction to the Semiconductor Industry 1.1 Development of an Industry
1.2 Circuits Integration
1.3 IC Fabrication
1.4 Semiconductor Trends
1.5 The Electronic Era
1.6 Career in the Semiconductor Industry 		1. Describe the current economic state and the technical roots of the semiconductor industry.
2. Explain what is an integrated circuit (IC) and list the five circuit integration eras.		  
2 Characteristics of Semiconductor Materials 2.1 Atomic Structure
2.2 The Periodic Table
2.3 Classifying Materials
2.4 Silicon
2.5 Alternative Semiconductor Materials 		1. Describe the atom, including valence shell, band theory and ions.
2. Interpret the periodic table with regards to main group elements and explain how ionic and covalent bonds are formed.		  
3 Device Technologies 3.1 Circuit Types
3.2 Passive Component Structures
3.3 Active Component Structures
3.4 Latchup in CMOS Devices
3.5 Integrated Circuit Products 		Identify differences between analog and digital devices and passive and active components. Explain the effects of parasitic structures in passive components.  
4 Silicon and Wafer Preparation 4.1 Semiconductor-Grade Silicon
4.2 Crystal Structure
4.3 Monocrystal Silicon Growth
4.4 Crystal Defects in Silicon
4.5 Wafer Preparation
4.6 Quality Measures
4.7 Epitaxial Layer 		1. Describe how raw silicon is refined into semiconductor grade silicon.
2. Explain the crystal structure and growth method for producing monocrystal silicon.		  
5 Chemicals in Semiconductor Fabrication 5.1 States of Matter
5.2 Properties of Materials
5.3 Properties of Chemicals 		1. Identify and discuss the four states of matter.
2. Describe the important chemical properties relevant to semiconductor manufacturing.		  
6 Contamination Control in Wafer Fabs 6.1 Types of Contamination
6.2 Sources and Control of Contamination
6.3 Wafer Wet-Cleaning 		1.描述無塵室之5種污染源形式，並討論每種污染源衍生之問題。
2.列出7項污染物之來源，並敘述其如何影響晶圓之潔淨度。
3.描述無塵室之潔淨等級。		  
7 Metrology and Defect Inspection 7.1 IC Metrology
7.2 Quality Measures
7.3 Analytical Equipment 		1.解釋為何要量測IC，並討論相關的儀器設備、良率與資料收集。
2.說明晶圓製作時的12項品質量測，並指出相關之製造步驟。		  
8 Gas Control in Process Chambers 8.1 Vacuum
8.2 Vacuum Pumps
8.3 Process Chamber Gas Flow
8.4 Residual Gas Analyzer
8.5 Plasma
8.6 Process Chamber Contamination 		1.解釋為何製作半導體之過程需要於反應室進行。
2.敘述真空環境之優點、真空範圍與其相關的幫浦。
3.說明真空反應室之氣體流動特性與其控制方法。		 作業
 		 
9 Midterm Review Ch1~Ch 8 確認上課內容是否完全吸收 期中考
 		 
10 Oxidation 9.1 Oxide Film
9.2 Thermal Oxidation Growth
9.3 Furnace Equipment
9.4 Horizontal Versus Vertical Furnaces
9.5 Oxidation Process
9.6 Quality Measures
9.7 Troubleshooting 		1.對半導體製造中之氧化薄膜描述其原子結構、不同的應用及優點。
2.敘述氧化之化學反應及描述在矽晶圓上氧化物如何成長。
3.解釋選擇性氧化及列舉兩個例子。		  
11 Deposition 10.1 Film Deposition
10.2 Chemical Vapor Deposition
10.3 CVD Deposition Systems
10.4 Dielectrics and Performance
10.5 Spin-on Dielectrics
10.6 Epitaxy
10.7 Deposition Quality Measures
10.8 Troubleshooting 		1.描述多層金屬化。討論薄膜的特性需求。敘述和解釋薄膜成長的3個階段。
2.簡述不同的薄膜沈積技術。
3.列出和描述化學氣相沈積的8個基本步驟，包括不同形式的化學作用。		  
12 Metallization 11.1 Metals and Metal Alloys used in Wafer Fab
11.2 Metal Deposition Systems
11.3 Metallization Schemes
11.4 Quality Measures
11.5 Troubleshooting 		1.解釋金屬化之專有名詞。
2.能列出和說明晶圓製造中6種金屬。討論每一種金屬的特性要求及應用。
3.能解釋銅金屬化在晶圓製造中之優點。描述銅製程之挑戰性。		  
13 Photolithography: Surface Preparation to Soft Bake 12.1 Photolithography Processes
12.2 Eight Steps of Photolithography
12.3 Vapor Prime
12.4 Spin Coat
12.5 Soft bake
12.6 Quality Measures
12.7 Troubleshooting 		1.解釋微影之基本觀念，包括製程、CD、光頻譜、解析度及曝光度。
2.討論正及負雕像術之差異。
3.說出並描述微影8個基本步驟。		 作業
平時考
 		 
14 Photolithography: Alignment and Exposure 13.1 Optical Lithography
13.2 Photolithograhy Equipment
13.3 Mix and Match
13.4 Quality Measures
13.5 Troubleshooting 		1.解釋微影中對準及曝光之目的。
2.描述微影中光的性質及曝光源的重要性。
3.對於光學雕像，敘述及說明光的重要觀點。
4.解釋解析度，描述它的關鍵參數及討論如何計算它。		  
15 Photolithography: Resist Development and Advanced Lithography 14.1 Post Exposure Bake
14.2 Develop
14.3 Hard Bake
14.4 Develop Inspect
14.5 Advanced Lithography
14.6 Quality Measures
14.7 Troubleshooting 		1.解釋傳統與化學倍增式DUV光阻為何與如何執行曝光後烘烤。
2.分別針對傳統與化學倍增式DUV光阻，描述其負與正光阻顯影製程。		  
16 Etch 15.1 Etch Parameters
15.2 Dry Etch
15.3 Plasma Etch Reactors
15.4 Dry Etch Applications
15.5 Wet Etch
15.6 Historical Perspective
15.7 Photoresist Removal
15.8 Quality Measures
15.9 Troubleshooting 		1.列出並討論9項重要的蝕刻參數。
2.解釋何謂乾蝕刻，包括它的優點並討論如何產生蝕刻作用。
3.列出並描述7種乾式電漿蝕刻反應器的設備系統。		  
17 Doping Processes 16.1 Diffusion
16.2 Ion Implantation
16.3 Ion Implanter
16.4 Ion Implant Trends in Process Integration
16.5 Quality Measures
16.6 Troubleshooting 		1.解釋晶圓製作中，摻雜的目的與應用。
2.討論摻質擴散的原理與製程。
3.提供有關離子植入之概要說明，包括它的優缺點。		  
18 Final Exam Review Ch13~Ch 17 確認上課內容是否完全吸收 作業
期末考
 		 


教學要點概述：
1.自編教材 Handout by Instructor：
□ 1-1.簡報 Slids
□ 1-2.影音教材 Videos
□ 1-3.教具 Teaching Aids
□ 1-4.教科書 Textbook
□ 1-5.其他 Other
□ 2.自編評量工具/量表 Educational Assessment
□ 3.教科書作者提供 Textbook

成績考核 Performance Evaluation： 期末考：40%   期中考：25%   其他評量：5%   平時考：25%   作業：5%  

教學資源(Teaching Resources)：
□ 教材電子檔(Soft Copy of the Handout or the Textbook)
□ 課程網站(Website)
扣考規定：https://curri.ttu.edu.tw/p/412-1033-1254.php